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LED flip technology +, materials, technology, products three arrows together!

  • Source:net
  • Release on :2017-06-17
Shenzhen Risen OPTO Co.,Ltd, Solar LED Flood Light, Solar Outdoor Lighting Supplier, Solor Sensor Flood Light.

"LED flip technology +, there are three aspects of the first, LED flip + material; second, LED flip + technology and equipment; third, LED flip + products." Manager Qian Xuexing June 10 at the fifteenth high industry LED industry peak forum speech said.

LED flip + technology and equipment, including CSP technology and equipment, including the integration of technology and equipment; LED flip-chip + LED and other products, including LED chip, phosphor, stent, solid crystal solder paste, Products include bulb COB, flexible filament, car lights, small spacing RGB, bar lights, etc., can determine the future of the flip package will cover most of the existing lighting, display, automotive lights and other applications.
Integrated packaging technology is the morning of 2013 independent research and development of the invention patent, but also the first LED flip-chip packaging process to define the company, the integration package is the chip through the solid crystal solder paste directly on the substrate, using the corresponding Optical parameters of the fruit powder on the substrate coating, the formation of point light and strip light source.
Fruit powder, also known as high-thixotropic plastic, the phosphor according to a certain percentage and silica gel mixed with the corresponding standard light color parameters, and through the glue system to maintain the phosphor in the shelf life does not occur precipitation. Fruit powder and CSP fluorescent glue has the same place, but their use and equipment are very different. Morninglight has been leading the development of fruit powder in the last two years and has formed its own intellectual property, and it is expected to simplify the flip-chip process through material changes.
In the process, LED integrated packaging process of fruit powder through the dispensing equipment in a specific pressure parameters under the brush on the flip chip, heat curing into finished products. The CSP process is the phosphor film containing the curing film to the flip chip non-electrode five sides or single-sided heat curing molding, and then cut the way to seal the flip chip into a miniaturized electronic light-emitting devices to Tape packing is easy to patch.
According to Qian Xuexing said, "LED integration process is simple, less production equipment, the circuit board package, no patch and other excess technology, but the disadvantage is not splitting, the fruit powder coating control and optical parameters consistency requirements; CSP packaging technology can achieve light-emitting device miniaturization, ultra-thin, but the disadvantage is the process is more complex, more equipment, cutting precision requirements.
As we all know, flip-chip in the flip-chip package does not only play a conductive, thermal, reflective, protective load and other effects, the solid crystal function position is flip-chip eutectic reaction material, so the choice of pad material on solid crystal solder paste Welding effect has a certain impact.
"In fact, 2016 COB will be the most rapid development of the year, from the COB aluminum substrate to the ceramic substrate to the flexible filament and then to the back of the SMD bracket, the original SMD is not suitable for flip, and later we cooperate with several manufacturers The process, made some improvement in the coating and structure of the upgrade. "Qian Xuexing said.
In addition, solid crystal solder paste is the key to flip innovation, not only the conductive thermal conductivity of the decisive material, but also the key factor in wafer bonding, so that the binding of the physical bonding from the glue to the solder paste alloy chemical Price combination. The quality of the flip-chip product is inseparable from the solid crystal solder paste.
Solid crystal solder paste the corresponding parameters of the model

LED packaging + packaging plastic manufacturing process on the packaging of plastic have a certain impact, the traditional package plastic use process is a phosphor plus A / B glue by a certain proportion of mixing evenly, after the bubble dispensing. And fruit powder in the LED integrated packaging technology without packaging engineers with their own phosphor and adjust the optical parameters.
It can be seen that different packaging materials to LED manufacturing process is simple, CSP packaging process is mainly reflected in the light source device miniaturization, standardization, we are now installed package SMD light source device, is the first sealant and then applied, And fruit powder is to help the integration of packaging directly in the application of end glue, process equipment more simple.
For LED integrated manufacturing process, there are five main steps:
A, choose the appropriate LED flip chip, and the LED chip directly installed in the PCB circuit board flip-chip eutectic;
B, will be installed on the LED flip chip chip PCB circuit board reflow eutectic welding;
C, the eutectic LED after the detection;
D, the detection of qualified eutectic LED after the residual cleaning;
E, the PCB circuit board for silicone packaging;
It is worth mentioning that the current morning technology has made a "chip package solid crystal solder paste and its preparation and use of technology", "LED integrated manufacturing process", "a high-thixotropic resin deposition of high thixotropic LED Fruit powder "and other LED flip technology related invention patents, through their own intellectual property and materials solutions, the layout of the future LED flip market.

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