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Your position:Home > News > Industry News > Japan developed a LED module t.....

Japan developed a LED module that can meet the requirements of high output power

  • Author:Eunice
  • Source:net
  • Release on :2016-04-09
         Shenzhen Risen OPTO Co.,Ltd,led flood light supplier,Aluminum Alloy Flood Light Manufacturers,waterproof led lamps supplier china.
         April 2016 the Japanese Ginza Tanaka Metal Industry Co., Ltd and S.E.I company 4, announced that use containing gold particles (0.1 M) low temperature bonding material "AuRoFUSE" and developed can meet the requirements of high output power of LED module. The influence of heat generated by the LED lighting in a lighted when, the output power will decrease. Therefore, the LED module exist the problem how to improve the heat dissipation. And the new products to solve this problem.
         The specific method is to use AuRoFUSE as bonding material for flip chip bonding, rather than the current mainstream way - wire bonding. Flip chip bonding together using projection terminals (bumps) electrically will chip is connected to the lead frame and the substrate and the LED chip is bonded to the substrate, as the heat source emitting surface close to the substrate, so easy to make the heat distribution. In addition, by removing the lead, not only can save the space occupied by the lead, the realization of miniaturization, but also can improve the electrical characteristics.
          However, in the past for flip chip bonding, must use expensive aluminum nitride on a substrate. This is because the expansion coefficient of metal substrate and LED chip low price hot there is a big difference, the joint is easy to damage. In this technique, containing gold particles as the bonding material of AuRoFUSE, these gold particles can ease the deformation of thermal expansion, we can use the metal substrate with low price. With this technology, high output power and miniaturization can be realized LED module.
         Tanaka Ki will be in April 6, 2016 in Tokyo metal Ming International Convention and Exhibition Center held the "Japan third high functional metal show", through the company's booth display module the LED. The future goal of the company is, the LED module uses extended to the import and export of frozen warehouse and can use the advantages of miniaturization of vehicle lighting etc..
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